Quick Job Search
Keywords:
Company Name:
Job Type:
Location:
Job Seeker Tools
Latest Jobs
Job Seeker Tools
Your Saved Jobs
Build Your Professional Profile
Similar Jobs
Fry's Food Stores
Fry's Retail Clerk -(Bella Vista & Hunt Hwy) in San Tan Valley, AZ
Veterans Health Administration
Program Support Assistant - Psychiatry in Phoenix, AZ
WALGREENS
Shift Lead in Phoenix, AZ
WALGREENS
Customer Service Associate - Temporary in Phoenix, AZ
WALGREENS
Inventory Specialist in Mesa, AZ
Dick's Sporting Goods
Retail Sales Associate - Lodge in Tucson, AZ
Wells Fargo
Principal Java Engineer in Chandler, AZ
Featured Employers
JR0161152 - Packaging R&D Engineer
Company: Intel
Location: Phoenix, AZ
Employment Type: Full Time
Date Posted: 06/14/2021
Expire Date: 08/13/2021
Job Categories: Engineering, Healthcare, Practitioner and Technician, Installation, Maintenance, and Repair, Manufacturing and Production, Military, Research & Development, Medical, Energy / Utilities
Job Description
JR0161152 - Packaging R&D Engineer

Substrate Packaging Technology Development (SPTD) Microelectronic Packaging Research and Development (R and D) Engineers enable substrate and packaging technologies for development of new materials, equipment, process flows and process improvements.

Responsibilities will include, but are not be limited to:


-Innovation, problem solving, development and continuous improvement of equipment and processes through application of experimental design and statistical methods.
-IC substrate process and equipment development, including application of novel concepts in manufacturing technology solutions for next-generation devices.
-Process and equipment specification development, application of principles for design of experiments and data analysis - in addition to planning and documentation of improvements through the change control process.
-The training of additional engineers and technicians to facilitate technology and process transfer to other factories worldwide for High Volume Manufacturing (HVM).

The ideal candidate should exhibit the following behavioral traits and/or skills:


-Written and verbal communication skills.
-Problem-solving, analytical and troubleshooting abilities.
-Flexibility in changing priorities and responsibilities to support business needs.
-Tolerance for ambiguity in a fast-paced, constantly changing product roadmap environment.
-Self-initiated, action-oriented with the willingness to work independently.
-Participation and a sense of ownership; frequent floor presence and interaction with manufacturing personnel.
-Demonstrate technical innovation and delivered results for complex, time-critical technical projects.
-Willingness to apply fundamental science and engineering concepts in development to create novel solutions.

This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below  minimum qualifications  to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • Candidate must possess a PhD. in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, Physics or a related field.


Preferred qualifications:

6+ months of experience in the following:

  • Plasma processing (PVD, CVD)
  • Electrochemical.
  • Process and equipment development for applications in the Integrated Circuit (IC), packaging or Printed Circuit Board (PCB) industry.
  • Semiconductor and/or IC substrate fabrication processes and technology.
  • Material structure-property relations, polymer and/or metal and/or composite material mechanical properties, solid mechanics, organic chemistry, organic composites and polymer chemistry and/or physics.
  • Optical microscopy, electron microscopy (SEM, FIB, TEM, and EBSD), analytical techniques (FTIR, Raman, TGA, DSC), Surface analysis (XPS, TOF-SIMS), EDS, AFM, XRD, mechanical cross-sections and other package-level failure analysis techniques.
  • Statistical data analysis, JMP/JSL, machine learning.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

USCollege GradJR0161152Phoenix
Contact Information
Company Name: Intel
Website: http://www.applytracking.com/x.aspx...
Company Description:

Apply Now | Forward Job to a Friend | More Jobs From This Employer